Compare Thermal Management Solutions Products
HTCX_ZF Non-Silicone Thermal Interface Material ![]() |
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HTCX_ZF Non-Silicone Thermal Interface Material ![]() |
HTCX_ZF Non-Silicone Thermal Interface Material ![]() |
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Type |
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Silicone | ||||
Non-silicone |
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Cure / Bonding |
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Yes | ||||
No |
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Interface / Gap Filling / Encapsulation |
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Interface |
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Gap filling | ||||
Encapsulation | ||||
Viscosity (Pa.s) |
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Viscosity Max | 95 | |||
Viscosity Min | 85 | |||
Thermal Conductivity (W/m.K) |
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Thermal Conductivity (W/m.K) | 1.65 | |||
Temperature (°C) |
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Min Temperature | -50 | |||
Max Temperature | 180 | |||
Electrically insulating |
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Yes |
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No | ||||
Density (g/mL) |
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Density (g/mL) | 2.28 | |||
Flame retardency |
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Yes |
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No | ||||
Application method |
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Screen printing |
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Auto/Manual Dispensing |
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Gap pad | ||||