Thermal Interface Materials & Solutions

ER2074

Thermally Conductive Epoxy Resin

ER2074 is a flame retardant system two component epoxy resin with UL94 V-0 approval with high thermal conductivity value of 1.26W/m.K.

ER2183

Thermally Conductive Epoxy Potting Compound

ER2183 is a thermally conductive epoxy resin meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke emission.

ER2220

Highly Thermally Conductive Epoxy Potting Compound

ER2220 is a flame retardant, thermally conductive epoxy encapsulation resin which combines ease of processing with an enhanced thermal conductivity.

ER2221

Thermally Conductive Epoxy Potting Compound

ER2221 resin has been formulated as high temperature resistant and thermally conductive potting compound which retains excellent characteristics throughout thermal cycling. ER2221 is coloured black.

GF400

Thermal Gap Filler

GF400 is a two part, liquid silicone based gap filler, which provides excellent thermal performance.

GF400

Thermal Gap Filler

GF400 is a two part, liquid silicone based gap filler, which provides excellent thermal performance.

GF600

Thermally Conductive Gap Filler

High performance thermal gap filler ideal for applications such as EV batteries

GP300

Thermal Gap Pad

GP300 is a silicone based thermal interface gap pad designed for easy application and good thermal conductivity.

HTC

Non-Silicone Thermal Interface Material

Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required.

HTCP

Non-Silicone Heat Transfer Compound Plus

HTCP provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.

HTCPX

Thermal Gap Filler

HTCPX provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.

HTCX

Non-Silicone Thermal Interface Material

Electrolube HTCX is an enhanced version of HTC featuring improved thermal conductivity, lower oil bleed, and lower evaporation weight loss.

HTCX

Non-Silicone Thermal Interface Material

Electrolube HTCX is an enhanced version of HTC featuring improved thermal conductivity, lower oil bleed, and lower evaporation weight loss.

HTCX_ZF

Non-Silicone Thermal Interface Material

HTCX_ZF is a Zinc Oxide free version of Electrolube's highly successful Heat Transfer Compound Xtra (HTCX).

HTS

Silicone Heat Transfer Compound

Silicone Heat Transfer Compound is a metal oxide filled silicone oil providing an extremely efficient and exceptionally thermally conductive compound which will operate over a wide temperature range.

HTSP

Silicone Heat Transfer Compound Plus

HTSP provides the ultimate in thermal conductivity together with the very wide temperature range obtained by using silicone base oils.

HTSX

Silicone Heat Transfer Compound Xtra

HTSX is a silicone thermal interface material which has been developed to perform in more extreme conditions than its sister product HTS.

TBS

Thermal Bonding System

Thermal Bonding System is a two part epoxy bonding system which utilises metal oxides to provide excellent thermal conductivity whilst being electrically insulating.

TCOR

RTV Thermally Conductive Oxime

TCOR Thermally Conductive Oxime is a single component, high thermal conductivity RTV for the effective bonding or gap filling in electronic devices.

TCRGUN

Cartridge Application Gun

Electrolube cartridge application gun, suitable for TCOR and TCER.