TBS

Thermal Bonding System

Thermal Bonding System is a two part epoxy bonding system which utilises metal oxides to provide excellent thermal conductivity whilst being electrically insulating.

TCRGUN

Cartridge Application Gun

Electrolube cartridge application gun, suitable for TCOR and TCER.

GP300

Thermal Gap Pad

GP300 is a silicone based thermal interface gap pad designed for easy application and good thermal conductivity.

HTCPX

Thermal Gap Filler

HTCPX provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.

HTCX

Non-Silicone Thermal Interface Material

Electrolube HTCX is an enhanced version of HTC featuring improved thermal conductivity, lower oil bleed, and lower evaporation weight loss.

HTCX_ZF

Non-Silicone Thermal Interface Material

HTCX_ZF is a Zinc Oxide free version of Electrolube's highly successful Heat Transfer Compound Xtra (HTCX).

HTS

Silicone Heat Transfer Compound

Silicone Heat Transfer Compound is a metal oxide filled silicone oil providing an extremely efficient and exceptionally thermally conductive compound which will operate over a wide temperature range.

HTC

Non-Silicone Thermal Interface Material

Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required.

HTCP

Non-Silicone Heat Transfer Compound Plus

HTCP provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.

HTCX

Non-Silicone Thermal Interface Material

Electrolube HTCX is an enhanced version of HTC featuring improved thermal conductivity, lower oil bleed, and lower evaporation weight loss.